Semiconductor Device and Method for Manufacturing Semiconductor Device
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United States of America Patent
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Issued Date -
Apr 30, 2015
app pub date -
Oct 17, 2014
filing date -
Oct 30, 2013
priority date (Note) -
Abandoned
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Abstract
This invention provides a semiconductor device with improved reliability. A semiconductor chip (semiconductor device) includes a plurality of electrode pads arranged in a plurality of lines extending along a side (chip side) of a perimeter of the semiconductor chip in plan view. Among the electrode pads, the areas of respective electrode pads arranged in a first line along the chip side are smaller than the areas of respective electrode pads arranged in a line located further than the first line from the chip side.
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