RESIN COMPOSITION, SUBSTRATE, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICES
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United States of America Patent
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Issued Date -
Apr 30, 2015
app pub date -
Oct 24, 2014
filing date -
Oct 25, 2013
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Abandoned
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Abstract
Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device having excellent light extraction efficiency. The resin composition contains a polymer and a solvent dissolving the polymer. The resin composition is used to form a layer, and when refractive indexes of the layer along two perpendicular in-plane directions thereof are respectively defined as “Nx” and “Ny” and a refractive index of the layer along a thickness direction thereof is defined as “Nz”, Nx, Ny and Nz satisfy a relationship of “(Nx+Ny)/2−Nz”>0.01. Further, a method of manufacturing the electronic device by using such a substrate, and the electronic device are also provided.
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