PVD APPARATUS FOR DIRECTIONAL MATERIAL DEPOSITION, METHODS AND WORKPIECE
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Apr 30, 2015
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Jun 18, 2013
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Jun 18, 2012
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Directional material deposition in physical vapor deposition (PVD) technology. In particular, the invention concerns PVD apparatus, which comprises a vacuum tight outer vessel accommodating a material source, at least two substrates arranged to define a substrate plane spaced apart from said material source, substrates facing the material source with a surface to be treated. The diameter of this material source is smaller, in particular significantly smaller, than the diameter of any of the substrates. Narrow angular distribution and a high level of uniformity is achieved at low substrate temperature.
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