Light emitting diode fabrication method
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United States of America Patent
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Sep 29, 2020
Grant Date -
Apr 23, 2015
app pub date -
Dec 31, 2014
filing date -
Nov 23, 2012
priority date (Note) -
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Abstract
A fabrication method for a light emitting diode (LED), including: 1) mounting a LED chip on a substrate; 2) mounting a screen printing template on the LED chip; 3) coating a silicone gel layer over the surface of the screen printing template; 4) printing the phosphor: printing the phosphor over the chip surface via silk screen printing process and recycling the excess phosphor; and 5) removing the screen printing template and baking the phosphor for curing, and coating the cured phosphor over the chip surface. In the packaging method of the present disclosure, the unused phosphor can be recycled because it is not polluted by the screen printing template material.
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