PACKAGE STRUCTURE OF OPTICAL MODULE
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United States of America Patent
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app pub date -
Dec 22, 2014
filing date -
Jul 25, 2013
priority date (Note) -
Abandoned
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Abstract
A package structure of an optical module is provided and includes: a light-emitting chip and a light-admitting chip which are disposed at a light-emitting region and a light-admitting region of a substrate, respectively; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively, and forming hemispherical first and second lens portions above the light-emitting chip and the light-admitting chip, respectively; a cover disposed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively, and the first and second lens portions are received in the light-emitting hole and the light-admitting hole, respectively. The encapsulants of the optical module package structure can be of unequal curvature as needed to enhance light emission efficiency of the light-emitting chip and enhance reception efficiency of the light-admitting chip.
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