RESIN COMPOSITION, METHOD OF MANUFACTURING RESIN COMPOSITION, SUBSTRATE, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

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United States of America Patent

APP PUB NO 20150108457A1
SERIAL NO

14520921

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Abstract

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Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device including a transparent resin film having an excellent display property, a method of manufacturing such a resin composition and a method of manufacturing the electronic device using such a substrate and the electronic device. The resin composition of the present invention contains an aromatic polyamide, an aromatic multifunctional compound having two or more functional groups including a carboxyl group or an amino group, and a solvent dissolving the aromatic polyamide.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO BAKELITE COMPANY LIMITEDSHINAGAWA-KU TOKYO 140-0002
AKRON POLYMER SYSTEMS INC62 NORTH SUMMIT STREET AKRON OH 44308

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harris, Frank W Boca Raton, US 87 2951
Inoue, Mizuho Kobe City, JP 12 25
Jing, Jiaokai Uniontown, US 34 134
Kawasaki, Ritsuya Kobe City, JP 19 46
Naito, Manabu Kobe City, JP 17 40
Okada, Jun Kobe City, JP 100 999
Sun, Limin Copley, US 45 172
Umeda, Hideo Kobe City, JP 28 54
Zhang, Dong Uniontown, US 236 2031

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