METHOD FOR PRODUCING CERAMIC CIRCUIT BOARDS FROM CERAMIC SUBSTRATES HAVING METAL-FILLED VIAS
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United States of America Patent
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Apr 23, 2015
app pub date -
Apr 30, 2013
filing date -
May 2, 2012
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Abstract
A method for producing ceramic circuit boards from ceramic substrates having metal-filled vias. In order to be able to fill the vias by means of a single filling process, either a planar copper metallization is applied on one side to the ceramic substrate having vias by means of scren printing, or a copper film of 100-300 μm is bonded on one side to the ceramic substrate having vias in a DCB/DBC process and the vias are filled from the ceramic side by means of an electrogalvanic process in a copper bath by the deposition of copper.
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