INORGANIC FILLER COATED WITH MOLYBDENUM COMPOUND AND USAGE THEREOF
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United States of America Patent
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Apr 16, 2015
app pub date -
Oct 1, 2014
filing date -
Oct 11, 2013
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Abstract
An inorganic filler coated with molybdenum compound used as an additive is added into a resin mixture in an amount of 20 to 80 wt % of the resin mixture, resulted in that printed circuit boards if made from a laminate or a prepreg containing the resin mixture have properties of a low coefficient of thermal expansion, good heat tolerance and excellent drilling processability.
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