METHOD TO SUSTAIN MINIMUM REQUIRED ASPECT RATIOS OF DIAMOND GRINDING BLADES THROUGHOUT SERVICE LIFETIME
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United States of America Patent
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Issued Date -
Apr 16, 2015
app pub date -
Oct 11, 2013
filing date -
Oct 11, 2013
priority date (Note) -
Abandoned
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Abstract
Embodiments of the present invention generally relate to a blade for isolating devices within a wafer and the method of isolating. The blade has a core material, a cutting material disposed on the core material, and a plating material covering a portion of the core and cutting materials. The edge of the blade is not covered by the plating material. During operation, a portion of the plating material is removed to expose the underlying core and cutting materials based on the wearing of the core and cutting materials at the edge of the blade.
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