Method and Apparatus of Growing Metal-free and Low Stress Thick Film of Diamond-like Carbon

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United States of America Patent

APP PUB NO 20150104648A1
SERIAL NO

14490692

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Abstract

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The presently claimed invention provides a metal-free and low stress thick film of diamond-like carbon (DLC). The diamond-like carbon layer of the present invention has a wide range of applications such as automotive coating, hydrophobic-hydrophilic tuning, solar photovoltaic, decorative coating, protective coating and bio-compatible coating. The presently claimed invention further provides a method and an apparatus to grow a metal-free and low stress thick film of diamond-like carbon by performing deposition and plasma etching to stack more than one diamond-like carbon layers together in the same chamber.

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Patent Owner(s)

Patent OwnerAddress
NANO AND ADVANCED MATERIALS INSTITUTE LIMITEDROOM 3641-3649 THE HONG KONG JOCKEY CLUB ENTERPRISE CENTER THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY HONG KONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
WANG, Zhonghui Alex HK, HK 6 55

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