ELECTROCONDUCTIVE COMPOSITION
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United States of America Patent
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Issued Date -
Apr 16, 2015
app pub date -
Apr 25, 2013
filing date -
Apr 27, 2012
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Abandoned
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Abstract
Provided is an electroconductive composition which not only shows excellent adhesion to a substrate and can easily form a smooth film, but also is applicable to the formation of a fine-pitched circuit and the like and capable of providing high electroconductivity even when dried at a relatively low temperature. The electroconductive composition comprises (A) a crystalline flake silver powder and (B) an organic binder, wherein the blending ratio of the (A) crystalline flake silver powder is 90% by mass to 98% by mass with respect the total solid content of the composition. In a preferred embodiment, the (A) crystalline flake silver powder contains polygonal single particles and has an average particle size (D50), which is determined by a laser diffraction-scattering particle size distribution analysis, of 1 μm to 3 μm.
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