PLASMA ETCHING APPARATUS

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United States of America Patent

APP PUB NO 20150102011A1
SERIAL NO

14285727

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A plasma etching apparatus includes first, second and third chambers, and a plasma generation device. An inner cross-sectional area and shape of the second chamber interior substantially corresponds to the upper surface of a substrate, and a substrate support is disposed so that, in use, the substrate is substantially in register with the interior of the second chamber, and the upper surface of the substrate is positioned at a distance of 80 mm or less from the interface between the second and third chambers.

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Patent Owner(s)

  • SPTS TECHNOLOGIES LIMITED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
VARVARA, MAXIME COPPONEX, FR 3 5

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