HEAT DISSIPATION DEVICE AND A METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Apr 16, 2015
app pub date -
Oct 13, 2014
filing date -
Oct 12, 2013
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Abstract
A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.
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