HYDROFORMED BOTTOM EXPANSION PROCESS AND APPARATUS

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United States of America Patent

APP PUB NO 20150101380A1
SERIAL NO

14474642

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Abstract

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An apparatus, and associated process, expands a wall of an associated metal container. The apparatus includes a holder for retaining at least a portion of the metal container. A first tool has a first surface mounted for movement relative to the holder for selective advancement toward and dimensioned to engage at least a portion of the associated metal container. The first tool includes a seal so that fluid received in the associated metal container is pressurized and used to apply an expanding force to the associated metal container as the first tool advances therein. A bubble is formed in the bottom wall, and in a second station, the combination of fluid pressure and metal forming surfaces make the final configuration of the bottom wall.

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Patent Owner(s)

Patent OwnerAddress
DAYTON SYSTEMS GROUP INC3003 SOUTH TECH BLVD MIAMISBURG OH 45342

International Classification(s)

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  • 2014 Application Filing Year
  • B21D Class
  • 716 Applications Filed
  • 620 Patents Issued To-Date
  • 86.60 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2014201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cook, Steven T Miamisburg, US 18 194

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Patent Citation Ranking

  • 4 Citation Count
  • B21D Class
  • 19.97 % this patent is cited more than
  • 10 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges117398549223101 - 1011 - 2021 - 3031 - 4051 - 6091 - 100100 +0255075100125150175200225250275300325350375400425

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