HYDROFORMED BOTTOM EXPANSION PROCESS AND APPARATUS
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United States of America Patent
Stats
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N/A
Issued Date -
Apr 16, 2015
app pub date -
Sep 2, 2014
filing date -
Mar 21, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Importance

US Family Size
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Non-US Coverage
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Abstract
An apparatus, and associated process, expands a wall of an associated metal container. The apparatus includes a holder for retaining at least a portion of the metal container. A first tool has a first surface mounted for movement relative to the holder for selective advancement toward and dimensioned to engage at least a portion of the associated metal container. The first tool includes a seal so that fluid received in the associated metal container is pressurized and used to apply an expanding force to the associated metal container as the first tool advances therein. A bubble is formed in the bottom wall, and in a second station, the combination of fluid pressure and metal forming surfaces make the final configuration of the bottom wall.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
EP | A1 | EP2976169 | Mar 21, 2014 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
APPLICATION PUBLISHED WITH SEARCH REPORT | HYDROFORMED CAN BOTTOM EXPANSION PROCESS AND APPARATUS | Jan 27, 2016 | |||
WO | A1 | WO2014153545 | Mar 21, 2014 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT | HYDROFORMED CAN BOTTOM EXPANSION PROCESS AND APPARATUS | Sep 25, 2014 | |||
WO | A1 | WO2016036855 | Sep 02, 2015 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT | HYDROFORMED BOTTOM EXPANSION PROCESS AND APPARATUS | Mar 10, 2016 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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DAYTON SYSTEMS GROUP INC | 3003 SOUTH TECH BLVD MIAMISBURG OH 45342 |
International Classification(s)

- 2014 Application Filing Year
- B21D Class
- 716 Applications Filed
- 620 Patents Issued To-Date
- 86.60 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Cook, Steven T | Miamisburg, US | 18 | 194 |
# of filed Patents : 18 Total Citations : 194 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 4 Citation Count
- B21D Class
- 19.97 % this patent is cited more than
- 10 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 16, 2026 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
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Feb 24, 2011 | FPAY | FEE PAYMENT | year of fee payment: 12 |
Mar 02, 2007 | FPAY | FEE PAYMENT | year of fee payment: 8 |
Dec 06, 2004 | FEPP | FEE PAYMENT PROCEDURE | free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Mar 27, 2003 | FPAY | FEE PAYMENT | year of fee payment: 4 |
Sep 28, 1999 | I | Issuance | |
Sep 20, 1999 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Nov 19, 1996 | F | Filing | |
Sep 10, 1996 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KOBAYASHI, EIICHI;DAIKUHARA, YUTAKA;REEL/FRAME:008319/0521 Owner name: MINEBEA KABUSHIKI-KAISHA, JAPAN Effective Date: Sep 10, 1996 |
Nov 20, 1995 | PD | Priority Date |

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