TSV Wafer Thinning Controlling Method and System
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United States of America Patent
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Issued Date -
Apr 9, 2015
app pub date -
Apr 15, 2014
filing date -
Jun 17, 2013
priority date (Note) -
Abandoned
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Abstract
A TSV wafer thinning controlling method and system is provided, which can improve the accuracy of the wafer thinning technique. The system includes a chuck table used for carrying a wafer and a grinding device used for thinning the wafer; and further includes: an infrared sensor equipped on the chuck table or grinding device, and a measurement feedback system connected with the infrared sensor and the grinding device; wherein, the infrared sensor comprises an infrared emitting and receiving circuit, signal amplifying and filtering circuit and a data processor.
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