ALUMINUM COATED COPPER BOND WIRE AND METHOD OF MAKING THE SAME
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United States of America Patent
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Issued Date -
Apr 9, 2015
app pub date -
May 7, 2013
filing date -
May 7, 2012
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Abandoned
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Abstract
The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, containing a copper core with a surface and a coating layer containing aluminum superimposed over the surface of the core. In any cross-sectional view of the wire, the area share of the coating layer is from 20 to 50% based on the total area of the cross-section of the wire, and the aspect ratio between longest and shortest paths through the wire is from larger than 0.8 to 1.0. The wire has a diameter of from 100 μm to 600 μm. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.
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