WAFER HOLDING STRUCTURE
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United States of America Patent
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Issued Date -
Apr 9, 2015
app pub date -
Oct 8, 2013
filing date -
Oct 8, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wafer holding structure for wafer backside processing, in which the wafer comprises a SiC substrate and a semiconductor device layer. The SiC substrate has a back surface and a front surface, and the semiconductor device layer has a first surface and a second surface. The semiconductor device layer is disposed on the SiC substrate with its first surface in contact with the front surface of the SiC substrate. The wafer holding structure comprises a wafer carrier and an adhesive coating. The wafer carrier is made of n-type conductive SiC, and has a thermal expansion coefficient that is well matched to the SiC substrate. The wafer carrier is mounted to the second surface of the semiconductor device layer and the adhesive coating is coated between the wafer carrier and the second surface of the semiconductor device layer.
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