Thermally Conductive Silicone Composition
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United States of America Patent
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Issued Date -
Apr 9, 2015
app pub date -
Mar 8, 2013
filing date -
Mar 12, 2012
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Abandoned
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Abstract
A thermally conductive silicone composition comprising: (A) an organopolysiloxane that is liquid at 25° C. and preferably has a viscosity of from 100 to 1,000,000 mPa·s; (B) an aluminum oxide powder having an average particle size of not more than 10 μm and preferably from 1 to 8 μm; and (C) an aluminum hydroxide powder having an average particle size of greater than 10 μm and preferably not greater than 50 μm, has low thixotropy, low specific gravity, and high thermal conductivity.
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