SUBSTRATELESS PACKAGES WITH SCRIBE DISPOSED ON HEAT SPREADER
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United States of America Patent
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Issued Date -
Apr 2, 2015
app pub date -
Sep 30, 2013
filing date -
Sep 30, 2013
priority date (Note) -
Abandoned
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Abstract
Disclosed is a substrateless semiconductor package having a plurality of scribe lines formed on a heat spreader, primarily comprising the heat spreader, a chip disposed on the heat spreader and an encapsulant. Formed on a thermally dissipating surface of the heat spreader are a plurality of scribe line grooves with a plurality of openings formed inside to penetrate through the die-attaching surface of the heat spreader. The chip is disposed on the die-attaching surface and the encapsulant is formed on the die-attaching surface to encapsulate a first surface of the chip on which a plurality of external pads are formed Without being covered by the encapsulant. Therein, the encapsulant is filled in the scribe line grooves via the openings so that a scribe line pattern exposed from the thermally dissipating surface is formed.
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