PLATING APPARATUS AND CLEANING DEVICE USED IN THE PLATING APPARATUS
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United States of America Patent
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Issued Date -
Apr 2, 2015
app pub date -
Sep 26, 2014
filing date -
Oct 2, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A plating apparatus for plating a substrate is disclosed. The plating apparatus includes: a dip-type plating bath; a dry-type plating bath having a hole in a sidewall thereof; and a pressing mechanism configured to press a substrate holder, holding a substrate, against the sidewall of the dry-type plating bath to close the hole. The substrate holder includes a base member and a holding member configured to sandwich the substrate therebetween, a first seal portion configured to seal a gap between the substrate and the holding member, a second seal portion configured to seal a gap between the base member and the holding member, and a third seal portion configured to seal a gap between the holding member and the sidewall of the dry-type plating bath.
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