SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

APP PUB NO 20150090298A1
SERIAL NO

14495724

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In a substrate processing device 10, a magnetic field forming unit is added to a solvent supply unit 58. The magnetic field forming unit 100 applies a magnetic field to a surface of a substrate W on which a cleaning liquid and a volatile solvent coexist. The magnetic field forming unit stirs and mixes the cleaning liquid and the volatile solvent on the surface of the substrate W to promote replacement of the cleaning liquid with the volatile solvent.

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Patent Owner(s)

Patent OwnerAddress
SHIBAURA MECHATRONICS CORPORATION5-1 KASAMA 2-CHOME SAKAE-KU YOKOHAMA-SHI KANAGAWA 247-8610

International Classification(s)

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  • 2014 Application Filing Year
  • B08B Class
  • 792 Applications Filed
  • 630 Patents Issued To-Date
  • 79.55 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAYASHI, Konosuke Yokohama-shi, JP 29 113
MATSUSHITA, Jun Yokohama-shi, JP 9 28
MIYAZAKI, Kunihiro Yokohama-shi, JP 56 592
NAGASHIMA, Yuji Yokohama-shi, JP 31 726
SAITO, Yuki Yokohama-shi, JP 66 404

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Patent Citation Ranking

  • 4 Citation Count
  • B08B Class
  • 16.82 % this patent is cited more than
  • 10 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges12854261184331101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 800255075100125150175200225250275300325350375400425450475500525550575

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