AQUEOUS WIRE SLICING FLUIDS AND RELATED METHODS OF SLICING
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United States of America Patent
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Issued Date -
Apr 2, 2015
app pub date -
Sep 26, 2014
filing date -
Sep 27, 2013
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Abandoned
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Abstract
An aqueous coolant fluid for cutting or machining a semiconductor substrate, comprising at least one organic phosphorous containing acid or salt thereof, at least one polyol; and at least one surfactant, and a method of cutting a silicon ingot or wafer using the coolant fluid.
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