Osteoconductive Implantable Component for a Bone Conduction Device
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United States of America Patent
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Issued Date -
Mar 26, 2015
app pub date -
Sep 20, 2013
filing date -
Sep 20, 2013
priority date (Note) -
Abandoned
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Abstract
An osteoconductive implantable component for use in coupling a bone conduction device to a recipient is provided. The implantable component is configured to be implanted adjacent to a recipient's bone and is configured to promote bone ingrowth and/or ongrowth to interlock the implantable component with the recipient's bone so as to prevent movement of the implantable component with respect to the recipient's skull.
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