SOY-BASED ADHESIVES WITH IMPROVED LOWER VISCOSITY
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United States of America Patent
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Issued Date -
Mar 26, 2015
app pub date -
Sep 19, 2014
filing date -
Sep 20, 2013
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Abstract
The technology is directed towards soy-based adhesive compositions having improved viscosity properties due to the use of soy flour having a particular particle size distribution. These compositions are useful for making lignocellulosic composites or engineered wood products.
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