POLYAMIDE RESIN COMPOSITION FOR PORTABLE ELECTRONIC DEVICE AND MOLDED ARTICLE FOR PORTABLE ELECTRONIC DEVICE
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United States of America Patent
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app pub date -
Nov 14, 2014
filing date -
Jan 13, 2006
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Abandoned
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Abstract
Provided is a polyamide resin composition having particularly excellent strength and low warpage by virtue of being compounded with a glass fiber and suited as a material for portable electronic devices that are becoming thinner and lighter in weight in recent years.
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