FLUORORESIN SUBSTRATE
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United States of America Patent
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Issued Date -
Mar 19, 2015
app pub date -
Mar 25, 2013
filing date -
Mar 26, 2012
priority date (Note) -
Abandoned
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Abstract
The invention offers a fluororesin substrate that has a dielectric layer being mainly composed of fluororesin and being formed on a metal conductor, that sufficiently suppresses the occurrence of warpage at the time of the reflow, and that enables the exhibiting of sufficiently outstanding high-frequency characteristics, the dielectric layer including hollow glass beads; a fluororesin substrate that has a metal conductor having a surface roughness, Rz, of 2.0 μm or less; a fluororesin substrate that has fluororesin irradiated with an ionizing radiation at an exposure dose of 0.01 to 500 kGy; and a fluororesin substrate that has fluororesin being one or two or more of polytetrafluoroethylene (PTFE), a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), a tetrafluoroethylene-hexafluoropropylene copolymer (FEP), and a tetrafluoroethylene-ethylene copolymer (ETFE).
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