PACKAGE STRUCTURE OF CRYSTAL OSCILLATOR WITH EMBEDDED THERMISTOR
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United States of America Patent
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Issued Date -
Mar 19, 2015
app pub date -
Dec 12, 2013
filing date -
Sep 13, 2013
priority date (Note) -
Abandoned
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Abstract
A package structure of crystal oscillator with embedded thermistor is disclosed. The package structure comprises a ceramic substrate. A crystal oscillation device is mounted in the accommodation space of the ceramic substrate. A cover is used to seal the accommodation space. At least one thermistor is embedded in the ceramic substrate. A patterned metal interconnection in the ceramic substrate is electrically connected with the crystal oscillation device and the thermistor, respectively. The present invention describes as follows: the thermistor is directly embedded in the ceramic substrate to avoid the short-circuit problem caused by electroplating a thermistor exposed and shorten a distance between the thermistor and the crystal oscillation device. Thus, the thermistor can more precisely sense the operating temperature of the crystal oscillation device to timely compensate frequency drift caused by changing the temperature of the crystal oscillation device.
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