FLOW PATH MEMBER, AND HEAT EXCHANGER AND SEMICONDUCTOR DEVICE USING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150076685A1
SERIAL NO

14389636

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Provided are a flow path member that suppresses flow path breakage, a heat exchanger and a semiconductor device using the same. This flow path member has a flow path in which a fluid flows and which is constituted by a lid portion, a partition wall portion, a side wall portion and a bottom plate portion. At least one of the partition wall portion and the sidewall portion is partly embedded in at least one of the lid portion and the bottom plate portion for direct connection.

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Patent Owner(s)

Patent OwnerAddress
KYOCERA CORPORATIONKYOTO-SHI KYOTO 612-8501
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI2-1 TOYODA-CHO KARIYA-SHI AICHI 4488671 JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Yuichi Kyoto-shi, JP 150 2247
Iwata, Yoshitaka Kariya-shi, JP 15 78
Kamiyama, Daizo Kariya-shi, JP 4 39
Mori, Shogo Kariya-shi, JP 81 544
Nabeshima, Yutaka Kyoto-shi, JP 18 235

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