METAL-ELECTRODEPOSITED INSULATOR SUBSTRATE AND METHOD OF MAKING THE SAME
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United States of America Patent
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Mar 19, 2015
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Sep 16, 2014
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Sep 16, 2013
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Abstract
A method of making a metal-electrodeposited insulator substrate includes: forming first and second continuous conductor parts of a patterned conductive base layer on a pattern-forming surface of an insulator substrate; subjecting an assembly of the patterned conductive base layer and the insulator substrate to electroplating so as to simultaneously form first and second electroplating parts of a patterned electroplating layer on the patterned conductive base layer; and removing a sacrificial portion of the first continuous conductor part and a sacrificial portion of the first electroplating part from the insulator substrate.
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