VSP SYSTEMS AND METHODS REPRESENTING SURVEY DATA AS PARAMETERIZED COMPRESSION, SHEAR, AND DISPERSIVE WAVE FIELDS
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Apr 2, 2012
filing date -
Apr 2, 2012
priority date (Note) -
Abandoned
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Abstract
Disclosed vertical seismic profiling (VSP) survey systems and method acquire multi-component signal data and represent the signal data in terms of a combination of parameterized compression, shear, and dispersive wavefields. Multiples of each wavefield type may be included, e.g., to separate upgoing and downgoing wavefield components. A nonlinear optimization is employed to concurrently estimate an incidence angle and a slowness value for each wavefield. For the dispersive wavefield(s), the slowness may be parameterized in terms of a phase slowness and a group slowness with respect to a central wave frequency. The parameter values may vary as a function of depth.
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