RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED RESIN ARTICLE WITH PLATED LAYER
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Sep 12, 2013
filing date -
Sep 14, 2012
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Abstract
Provided is a resin composition capable of achieving a higher plating property. The resin composition comprises relative to 100 parts by weight of a resin component comprising 30 to 100% by weight of a polycarbonate resin and 70% by weight or less of a styrene-based resin, 10 to 100 parts by weight of a glass filler and 2 to 20 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive comprises a metal oxide, a component of the largest blending amount among the metal components is tin, a component of the second largest blending amount is antimony, and in addition lead and/or copper are contained.
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