Release Film, Compression Molding Method, And Compression Molding Apparatus
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Apr 23, 2013
filing date -
Apr 27, 2012
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a release film used by being interposed between a molding material and a mold when the molding material is compression molded using the mold in order to form a sealing material or reflective frame material for an optical semiconductor element, or a lens, wherein the release film comprises a silicone-based cured product layer (2) on at least a surface in contact with the molding material; as well as a compression molding method that uses the film; and a compression molding apparatus that uses the film. The release film for the compression molding of molding materials has good workability and has good releasability, and thereby, a compression molding method with which compression molding with good efficiency is possible and a compression molding apparatus with which molding with good efficiency is possible.
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