HEAT-DISSIPATING DEVICE FOR INTERFACE CARD
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United States of America Patent
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N/A
Issued Date -
Mar 12, 2015
app pub date -
Aug 13, 2014
filing date -
Sep 9, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat-dissipating device for interface card is disposed on an interface card. The heat-dissipating device includes a heat sink, a housing, and a fan. The heat sink is disposed on the interface card. The housing is disposed on the heat sink. The housing has a top plate and two side plates connected to the top plate. The top plate has an inlet opening. An inner surface of the top plate proximate to the inlet opening has a protruding wall and an opening. The protruding wall has a curve panel. The fan is arranged in the housing and correspondingly arranged at the inlet opening. The fan has a rotational shaft, a plurality of axial fan blades, and centrifugal fan blades. The rotational shaft is pivotally disposed on a bottom seat. The assembled heat-dissipating device can optimize air flow to improve heat dissipation and effectively improve heat dissipating rate.
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