CHIP PACKAGE, CHIP PACKAGE MODULE BASED ON THE CHIP PACKAGE, AND METHOD OF MANUFACTURING THE CHIP PACKAGE
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Oct 29, 2013
filing date -
Sep 10, 2013
priority date (Note) -
Abandoned
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Abstract
A chip package is formed of a complex substrate and a chip. The complex substrate includes a core plate, a thermally-conductive insulated layer, and a through hole running through the core plate and the thermally-conductive insulated layer. The core plate is fixed to the core plate and buried into the thermally-conductive insulated layer. An upper electrode of the chip is connected with a first circuit layer. The first circuit layer is disposed on a top side of the thermally-conductive insulated layer, into the through hole, and on a lower surface of the core plate. A lower electrode of the chip is connected with a second circuit layer. The second circuit layer is disposed on the lower surface of the core plate. In light of the structure, the chip package has a simplified manufacturing process and reduces the production cost and the package size.
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