LIGHT EMITTING DIODE PACKAGE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150069441A1
SERIAL NO

14476147

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode mounted on opposite sides of the substrate, an LED chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding, and a reflecting cup enclosing an outer periphery of the first electrode and the second electrode to expose top surfaces of the first electrode and the second electrode and bottom surfaces of the first electrode and the second electrode.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED OPTOELECTRONIC TECHNOLOGY INCNO 13 GONGYE 5TH RD HSINCHU INDUSTRIAL PARK HUKOU TOWNSHIP HSINCHU COUNTY 303

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, CHAO-HSIUNG Hukou, TW 75 231
CHEN, LUNG-HSIN Hukou, TW 101 330
CHEN, PIN-CHUAN Hukou, TW 96 225
LIN, HOU-TE Hukou, TW 67 179
YEH, FU-HSIANG Hukou, TW 4 3

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  • H01L Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1377800619237183722181459473474314501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +05001000150020002500300035004000450050005500600065007000750080008500

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