LIGHT EMITTING DIODE PACKAGE
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Sep 3, 2014
filing date -
Sep 9, 2013
priority date (Note) -
Abandoned
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Abstract
A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode mounted on opposite sides of the substrate, an LED chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding, and a reflecting cup enclosing an outer periphery of the first electrode and the second electrode to expose top surfaces of the first electrode and the second electrode and bottom surfaces of the first electrode and the second electrode.
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