Solder Powder
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Mar 20, 2013
filing date -
Mar 26, 2012
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Abstract
The invention relates to a solder powder for connecting components made of aluminium or aluminium alloys by brazing, in particular a brazing powder for connecting heat exchanger components. The solder powder consists of powder particles on an aluminium-silicon base having a weight fraction of more than 12% by weight of silicon, wherein the powder particles have been produced by a rapid solidification and contain uniformly distributed silicon primary crystal precipitations in the eutectic aluminium-silicon alloy structure. Coating with such a solder powder leads to a uniform distribution of the silicon on the surface of the component coated with solder powder and thus to the same good soldering results.
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