COMPUTING DEVICE AND METHOD FOR ANALYZING ASSEMBLY CLEARANCE BETWEEN TWO COMPONENTS OF PRODUCT
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United States of America Patent
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Mar 5, 2015
app pub date -
Aug 29, 2014
filing date -
Aug 29, 2013
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Abstract
In a method for analyzing an assembly clearance between two components of a product using a computing device, the assembly clearance between the two components is scanned to obtain a point cloud of the assembly clearance using a scanning device. The method meshes points of the point cloud to generate triangular grids, and divides the triangular grids of the point cloud into two planes of the product. The method calculates a distance between a center point of each triangular grid of an assembly plane and a base plane of the product, and stores all the distances to a clearance deviation array of the assembly clearance. A deviation analysis diagram of the assembly clearance is generated based on the clearance deviation array, and each triangular grid of the base plane of the product is highlighted using a color difference indication.
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