SEMICONDUCTOR DEVICE HAVING A DIAMOND SUBSTRATE HEAT SPREADER
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United States of America Patent
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app pub date -
Oct 28, 2014
filing date -
Feb 2, 2009
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Abstract
In accordance with one or more embodiments, a semiconductor device comprises a semiconductor die having a heat region disposed on at least one portion of the semiconductor die, and a diamond substrate disposed proximate to the semiconductor die, wherein the diamond substrate is capable of dissipating heat from the diamond substrate via at least one or more bumps coupling the diamond substrate to the heat region of the semiconductor die.
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