SYSTEM FOR ATTACHING DEVICES TO FLEXIBLE SUBSTRATES
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United States of America Patent
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Issued Date -
Mar 5, 2015
app pub date -
Sep 4, 2013
filing date -
Sep 4, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
This disclosure is directed to a system for attaching devices to flexible substrates. A device may be coupled to a flexible substrate in a manner that prevents adhesive from contacting conductive ink while the adhesive is harmful. If conductive epoxy is used to anchor conductive pads in the device to the flexible substrate, conductive epoxy may be applied beyond the edge of the device over which conductive ink may be applied to make electrical connections. Holes may also be formed in the flexible substrate allowing conductive epoxy to be exposed on a surface of the flexible substrate opposite to the device location, the conductive ink connections being made on the opposite surface. The conductive ink may also be applied directly to the conductive pads when extended beyond the device's edge. The flexible substrate may be pre-printed with circuit paths, the conductive ink coupling the device to the circuit paths.
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