Barrier Layer For Electrostatic Chucks
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United States of America Patent
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Issued Date -
Mar 5, 2015
app pub date -
Aug 27, 2013
filing date -
Aug 27, 2013
priority date (Note) -
Abandoned
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Abstract
An electrostatic chuck for implanting ions at high temperatures is disclosed. The electrostatic chuck includes an insulating base, with electrically conductive electrodes disposed thereon. A dielectric top layer is disposed on the electrodes. A barrier layer is disposed on the dielectric top layer so as to be between the dielectric top layer and the workpiece. This barrier layer serves to inhibit the migration of particles from the dielectric top layer to the workpiece, which is clamped on the chuck. In some embodiments, a protective layer is applied on top of the barrier layer to prevent abrasion.
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