EMBEDDED DIE PACKAGE
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United States of America Patent
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Issued Date -
Mar 5, 2015
app pub date -
Aug 28, 2013
filing date -
Aug 28, 2013
priority date (Note) -
Abandoned
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Abstract
A method of making an electrical assembly includes making a laminate substrate, embedding a plurality of integrated circuit dies in the laminate substrate, forming a plurality of through-holes in the laminate substrate and adding conductive material to the through-holes, and making at least one saw cut extending through the laminate substrate and through the plurality of through-holes and the conductive material therein to form at least one laminate block with a cut face and a plurality of sectioned through-holes.
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