CERAMIC CIRCUIT BOARD AND LED PACKAGE MODULE USING THE SAME
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United States of America Patent
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Issued Date -
Mar 5, 2015
app pub date -
Feb 3, 2014
filing date -
Sep 5, 2013
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Abandoned
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Abstract
A ceramic circuit board includes a substrate made of Al2O3 or AlN and having an exterior surface and a groove recessed from the exterior surface. The groove has a bottom surface provided with a roughness Ra of 1-20 μm, a plurality of crests and a plurality of troughs. The crests are located in an imaginary plane separated from the exterior surface at a distance of 1-100 μm. An electro-conductive wire is embedded in the groove and has a top surface flush with the exterior surface. An LED package module includes a ceramic circuit board having two embedded electro-conductive wires, two bonding pads respectively mounted on the top surfaces of the wires, and an LED chip having two contacts electrically connected with the bonding pads respectively. The electro-conductive wire is connected with the substrate firmly and made relatively thicker capable of carrying a relatively larger electric current.
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