PACKAGE OF LIGHT EMITTING DIODE CHIPS
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United States of America Patent
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Issued Date -
Mar 5, 2015
app pub date -
Jun 10, 2014
filing date -
Aug 28, 2013
priority date (Note) -
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Abstract
The present invention provides a package of LED chips. The package comprises a transparent plate having a front surface and a rear surface, a plurality of LED chips disposed on the front surface, two opposite front surface reflective walls disposed on the front surface and located at two opposite outsides of the plurality of LED chips, a front surface phosphor gel filling between the two opposite front surface reflective walls, two opposite rear surface reflective walls disposed on the rear surface and a rear surface phosphor gel filling between the two opposite rear surface reflective walls. The present invention realizes the light of the package of LED chips can be extracted from both the front side and the rear side to enhance the light extraction efficiency.
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