Method of manufacturing gold thin film by using electroless-plating method

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United States of America Patent

APP PUB NO 20150056379A1
SERIAL NO

14467035

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Abstract

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Provided is a method of manufacturing a gold (Au) thin film on a dielectric surface by using an electroless-plating method, the method including: manufacturing a reaction mixture by adding an Au chloride compound and an alkaline compound to an alcohol-water mixed solution; and forming an Au thin film by putting a substrate in the reaction mixture and stirring the reaction mixture. Accordingly, compounds that are relatively low toxic may be used as raw materials, and an Au thin film having a surface enhancement Raman scattering (SERS) effect may be conveniently and stably formed on a dielectric surface without having to use expensive additional equipment, such as a vacuum device.

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Patent Owner(s)

Patent OwnerAddress
SOONGSIL UNIVERSITY RESEARCH CONSORTIUM TECHNO-PARK511 SANGDO-DONG DONGJAK-GU SEOUL 156-030

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHO, Young Kwan Incheon, KR 3 6
PARK, Myung Chan Seongnam, KR 2 11
SHIN, Kuan Soo Seoul, KR 3 1

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