DEPOSITION METHOD AND DEPOSITION APPARATUS

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United States of America Patent

APP PUB NO 20150056373A1
SERIAL NO

14348006

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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[Object] To provide a deposition method and a deposition apparatus capable of forming a metal compound layer having desired film characteristics uniformly in a substrate surface.

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Patent Owner(s)

Patent OwnerAddress
ULVAC INCKANAGAWA JAPAN KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuda, Natsuki Shizuoka, JP 21 75
Fukuju, Kazunori Shizuoka, JP 3 12
Nishioka, Yutaka Shizuoka, JP 21 111
Suu, Koukou Shizuoka, JP 55 882

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