Method for Producing Wafer Lens

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United States of America Patent

SERIAL NO

14280881

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a method for producing a wafer lens wherein a glass substrate is provided with a lens part which is made of a first curable resin. A sub-master molding part having a plurality of negative molding surfaces corresponding to the optical surface shape of the lens part is formed from a master having a plurality of positive molding surfaces corresponding to the optical surface shape of the lens part by using a second curable resin; a sub-master is formed by backing the sub-master molding part with a sub-master substrate; and the lens part is formed by filling the space between the sub-master and the glass substrate with the first curable resin and curing the resin therein. In this connection, the first curable resin is composed of an epoxy resin. Consequently, the production cost can be reduced, and a high-precision wafer lens having small curing shrinkage can be produced.

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Patent Owner(s)

Patent OwnerAddress
KONICA MINOLTA OPTO INC2970 ISHIKAWA-MACHI HACHIOJI-SHI TOKYO 192-8505

International Classification(s)

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  • 2014 Application Filing Year
  • B29C Class
  • 4829 Applications Filed
  • 3911 Patents Issued To-Date
  • 80.99 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2014201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Watanabe, Daisuke Tokyo, JP 311 1900

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Patent Citation Ranking

  • 6 Citation Count
  • B29C Class
  • 21.83 % this patent is cited more than
  • 10 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges37211181374511843111301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +05010015020025030035040045050055060065070075080085090095010001050110011501200

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