LED CHIP PACKAGE
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United States of America Patent
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Issued Date -
Feb 26, 2015
app pub date -
Aug 20, 2013
filing date -
Aug 20, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An LED chip package having a topographical glass coating on top surface for enhancing heat dissipation is disclosed. A circular wall is optionally built to surround the LED chip for reflecting light beams from the LED chips; the glass coating further extends to cove the inner wall surface of the circular wall. The larger area the glass coating covers, the more heat the package dissipates in a time unit. The LED chip package according to the present invention exhibits higher thermal dissipation and helps to last longer the life of the LED chip package than a traditional one.
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