Light emitting diode package and method for manufacturing same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9543283
APP PUB NO 20150054009A1
SERIAL NO

14310575

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Abstract

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An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED OPTOELECTRONIC TECHNOLOGY INCNO 13 GONGYE 5TH RD HSINCHU INDUSTRIAL PARK HUKOU SHIANG HSINCHU HSIEN 303

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chao-Hsiung Hsinchu, TW 75 231
Chen, Lung-Hsin Hsinchu, TW 101 330
Chen, Pin-Chuan Hsinchu, TW 96 225
Lin, Hou-Te Hsinchu, TW 67 179
Yeh, Fu-Hsiang Hsinchu, TW 4 3

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