BALL PLANTING DEVICE AND BALL PLANTING METHOD THEREOF
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United States of America Patent
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app pub date -
May 22, 2014
filing date -
Aug 23, 2013
priority date (Note) -
Abandoned
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Abstract
The present disclosure relates to a ball planting device for mounting a solder ball and a ball planting method thereof. The device includes a substrate, a dielectric layer, and a solder paste. The substrate includes a surface. The dielectric layer is disposed on the surface. The dielectric layer includes a plurality of apertures. The solder paste fills the apertures. A top surface of the solder paste is aligned with an exposed surface of the dielectric layer.
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