Heating elements for aircraft heated floor panels
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United States of America Patent
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Apr 18, 2017
Issued Date -
N/A
app pub date -
Feb 12, 2014
filing date -
Aug 21, 2013
priority date (Note) -
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Abstract
A method of forming a heating element includes depositing a conductive ink of silver particles in an epoxy resin on a dielectric film to create a conductive circuit, and heat curing the conductive circuit to achieve a resistivity of the heating element less than 1.68×10−6 ohm·meter. An aircraft heated floor panel includes at least one floor panel of an aircraft includes a conductive circuit positioned within the floor panel having a conductive ink of silver particles in an epoxy resin on a dielectric film.
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International Classification(s)
- H05B:ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE ....
- B64D:EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLYING SU....
- F24D:DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL H....
- B64C:AEROPLANES; HELICOPTERS
- B60L:ELECTRIC EQUIPMENT OR PROPULSION OF ELECTRICALLY-P....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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